Panel with releasable core

ABSTRACT

Generally discussed herein are systems and apparatuses that can include a releasable core panel. The disclosure also includes techniques of making and using the systems and apparatuses. According to an example a technique of making a releasable core panel can include coupling an inner foil to a substantially rectangular base, situating an outer conductive foil situated on the inner foil, or coupling, using a connective material, the inner foil and the outer conductive foil near edges of the outer conductive foil and the inner foil.

RELATED APPLICATION

This application is a continuation of U.S. patent application Ser. No.14/227,723, filed Mar. 27, 2014, which is a continuation-in-part to U.S.patent application Ser. No. 14/135,168, filed Dec. 19, 2013, each ofwhich are incorporated herein by reference in their entirety.

TECHNICAL FIELD

Examples generally relate to panel architectures and methods, such aspanel architectures can facilitate the formation of a substrate thereon.

TECHNICAL BACKGROUND

Substrate manufacturing technology can include the use of panels to helpincrease the number of dies that can be manufactured at a given time.Substrate manufacturing can be inefficient, wasteful, or costprohibitive. Such problems can be prevalent when building substratesusing one or more panels.

BRIEF DESCRIPTION OF THE DRAWINGS

In the drawings, which are not necessarily drawn to scale, like numeralsmay describe similar components in different views. Like numerals havingdifferent letter suffixes may represent different instances of similarcomponents. The drawings illustrate generally, by way of example, butnot by way of limitation, various embodiments discussed in the presentdocument.

FIG. 1 shows a block diagram of an example of a core panel architecture.

FIG. 2 shows a flow diagram of an example of a technique used to createthe core panel architecture of FIG. 1.

FIG. 3 shows a flow diagram of an example of another core panelarchitecture.

FIG. 4 shows a block diagram of an example of a panel according to oneor more embodiments.

FIG. 5 shows a block diagram of another example of a panel according toone or more embodiments.

FIG. 6 shows a block diagram of yet another example of a panel accordingto one or more embodiments.

FIG. 7 shows a block diagram of the panel of FIG. 6 with a fullyembedded substrate built on the panel according to one or moreembodiments.

FIG. 8 shows a block diagram of the panel of FIG. 7 with edges of thepanel removed.

FIG. 9 shows a block diagram of the panel of FIG. 6 with a partiallyembedded substrate built on the panel according to one or moreembodiments.

FIG. 10 shows a flow diagram of an example of a technique of making apanel according to one or more embodiments.

FIG. 11 shows a flow diagram of another example of a technique of makinga panel according to one or more embodiments.

FIG. 12 shows a block diagram of an example of a computer system.

DESCRIPTION OF EMBODIMENTS

Examples in this disclosure relate generally to substrates or panels,such as panels that can include cureless or cored substrates builtthereon, and techniques of making and using the same. Examples alsorelate to systems that can include one or more of the substrates orpanels.

Previous techniques for creating a releasable core panel includereleasably coupling a conductive foil to a base through either vacuumpressing the conductive foil to the base or pressing the conductive intoan adhesive layer on the base.

A premature delamination of a conductive foil can cause yield loss inmanufacturing a substrate on the conductive foil. Another problemrealized in manufacturing can include a warping a conductive foil ordamaging an adhesive layer that couples the conductive foil to a base ofthe panel. When the conductive foil warps, the adhesion strength betweenthe conductive foil and the base can be reduced (e.g., the peel strengthrequired to remove the conductive can be reduced), thus making it easierfor the conductive foil to be delaminated. Likewise, when the adhesivelayer is damaged, the adhesion strength between the conductive foil andthe base can be reduced.

A technique to reduce the risk of the conductive foil being delaminatedor warped can include moving the contact area of the conductive foilinward from the edge of the panel so as to help protect the conductivefoil from substrate manufacturing equipment. Such a panel is shown inFIG. 1.

FIG. 1 shows a block diagram of a panel 100. The panel 100 can include abase 102, an inner foil 104A or 104B, an adhesive layer 106A or 106B, oran outer conductive foil 108A or 108B. The outer conductive foil 108A-Bcan include a width 110A or 1108 that is smaller than a width 112 of thebase 102 or the inner foil 104A-B. The smaller width can provide an edgewidth 114A or 114B at which manufacturing equipment can grasp orotherwise contact the inner foil 104A-B, such as to reduce contact withthe outer conductive foil 108A-B or the adhesive layer 106A-B duringsubstrate manufacturing. However, including such an edge width 114A-Bcan reduce an area on which a substrate can be manufactured (e.g., theactive area). The edge width 114A-B can reduce such an area by ten ormore millimeters. A peel strength of the adhesive layer 106A-B can bedamaged by heat, bumping, or a chemical that comes into contact with theadhesive layer 106A-B.

FIG. 2 shows a flow diagram of a technique 200 of making the panel ofFIG. 1. At 202, the inner foil 104A-B, outer conductive foil 108A-B, andadhesive layer 106A-B can be pressed into the base 102. At 204, amasking film (e.g., Dry Film Resist (DFR)) can be laminated to the outerconductive foil 108A-B. At 206, the panel 100 can be exposed and etchedto remove the outer conductive foil at or near the edges of the panel.At 208, the masking film can be removed from the panel. At 210, asubstrate can be manufactured on the outer conductive foil 108A-B. At212, edges of the panel 100 can be removed. At 214, the manufacturedsubstrate can be released from the panel 100. One or more process stepscan be eliminated, such as by using a different panel architecture asdiscussed below. Eliminating a processing step can help reduce a costassociated with manufacturing a panel on which a substrate can be built.

FIG. 3 shows an example of a core panel 300. The panel 300 can include abase 302, an inner foil 304A or 304B, an outer conductive foil 306A or306B, or a resin 308A or 308B coating on an outermost conductive foil310A or 310B. The inner foil 304A-B and the outer conductive foil 306A-Bcan include a width 312A or 312B that is less than a width 314A or 314Bof the outermost conductive foil 310A-B and the base 302. The resin308A-B and the outermost conductive foil 310A can jointly comprise aresin coated conductive layer. The resin coated conductive layer (i.e.308A and 310A or 308B and 310B) can be pressed into the outer conductivefoil 306A-B so as to form a temporary bond or seal between the resin308A-B and the outer conductive foil 306A-B.

The base 302 can begin as a substantially rectangular structure and beprocessed to be generally “H” shaped, such as by forming a recess ineach side of the base 302. The recesses in FIG. 3 are the areas in whichthe inner foil 304A-B and the outer conductive foil 306A-B are situated.

A substrate can be built on the outermost conductive foil 310A-B. Theresin coated conductive layer can be removed from the base 302 and theouter conductive foil 306A, such as with the substrate thereon(substrate not shown in FIG. 3). The resin coated conductive layer canbe removed from the substrate such as by etching, wet blasting, or acombination thereof.

The panel 300 can be cost prohibitive. Arranging the inner foil 304A-Band the outer conductive foil 306A-B within a recess in the base 302(such as shown in FIG. 3) can increase the cost of the panel 300. Theincrease in cost can be due, at least in part, to extra processing thatis required to arrange the inner foil 304A-B and the outer conductivefoil 306A-B in a recess of the base 302. The increase in cost can bedue, at least in part, to processing conductive foil panels to be thewidth 312A-B, and inserting the modified foil panels into the recess inthe base 302.

FIG. 4 shows an example of a panel 400 according to one or moreembodiments. The panel 400 can be configured to protect an interfacebetween an adhesive layer 406A or 406B and an inner foil 404A or 404B oran outer conductive foil 408A or 408B (e.g., the area of the panel 400covered by a protective material 412A or 412B). The panel 400 caninclude a base 402, the inner foil 404A-B, the adhesive layer 406A-B,the outer conductive foil 408A-B, a die 410A or 410B, or the protectivematerial 412A-B.

The base 402 can be substantially rectangular. The base 402 can includea material that is rigid enough to withstand processing at a substratemanufacturing factory and retain shape. In one or more embodiments, thebase 402 can include a material impregnated with a polymer. In one ormore embodiments, the base 402 can include a carbon material impregnatedwith an epoxy or resin. In one or more embodiments, the base 402 caninclude a metal, plastic, or other substantially rigid material. Thebase 402 can be generally rectangular and generally flat.

The inner foil 404A-B can be affixed to the base 402. A periphery of theinner foil 404A-B can be substantially flush with a periphery of thebase 402, such as shown in FIG. 4. The inner foil 404A-B can include aconductive material such as copper, gold, silver, aluminum, acombination thereof, or other conductive material. In one or moreembodiments the inner foil 404A-B can include a thickness 416A or 416Bof between about ten and forty micrometers. In one or more embodiments,the inner foil 404A-B can include a thickness 416A-B of between aboutfifteen and about twenty micrometers. In one or more embodiments, theinner foil 404A-B can include a thickness 416A-B of about eighteenmicrometers.

The adhesive layer 406A-B can releasably couple the outer conductivefoil 408A-B to the inner foil 404A-B. The adhesive layer 406A-B caninclude an epoxy, resin, a combination thereof, or other material. Theadhesive layer 406A-B can be pressed (e.g., hot pressed, baked withpressure, or laminated) into the inner foil 404A-B. Such pressing canform a releasable coupling between the inner foil 404A-B and the outerconductive foil 408A-B, such as shown in FIG. 4.

The base 402 and the outer conductive foil 408A-B can be releasablyuncoupled, such as by mechanically removing (e.g., pulling) the outerconductive foil 408A-B away from the inner foil 404A-B. The outerconductive foil 408A-B can be removed from the inner foil 404A-B after asubstrate (e.g., the die 410A-B and associated dielectric materials,vias, traces, interconnects, or other electric or electronic circuitry)has been manufactured on the panel 400. The outer conductive foil 408A-Bcan be removed from the panel 400 after edges of the panel 400 have beenremoved. The edges of the panel 400 can be removed by cutting the panelalong the dotted lines 414A and 414B. Removing the edges can expose theinterface between the adhesive layer 406A-B and the inner foil 404A-Band the outer conductive foil 408A-B, such as by removing the protectivematerial 412A-B on the edge (e.g., along the side) of the panel 400. Theouter conductive foil 408A-B can then be released from the panel 400.

The adhesive layer 406A-B can include a methyl ethyl ketone and toluenesolvent with polydimethyl siloxane and bisphenol A based epoxy. Anadhesive layer 406A-B made from these materials can suffer from phaseseparation between the epoxy and silicone over time. Heat can causeblisters to form in the adhesive layer 406A-B made from these materials.The adhesive strength of such adhesive layer 406A-B can degrade overtime. An adhesive layer made of these materials can have poor lineyields, such as in a substrate manufacturing factory.

As used herein releasably coupling means to couple such that amechanical coupling through the adhesive layer 406A-B can be brokenwithout requiring excessive force or damaging the items mechanicallycoupled through the adhesive layer 406A-B. The adhesive layer 406A-B canbe released from an item by exerting a relatively small amount of force,such as about five Newtons per meter to about one hundred Newtons permeter on or near the adhesive layer 406A-B.

The adhesive layer 406A-B can include one or more epoxy siliconecopolymers or blends of polymers, silicone, or epoxy. Different blendscan be used to make adhesive layer 406A-B with varying mechanicalproperties, such as depending on the volume weight percent of polymer,silicone, or epoxy used. The mechanical properties can include hardness,elasticity, stickiness, or other mechanical property.

The adhesive layer 406A-B can include an epoxy and silicone blend. Forexample, siloxane and epoxy resin can be blended together with acarboxylic acid anhydride hardener, such as to produce a stable orwell-blended adhesive layer 406A-B. This blend can be used as anadhesive by controlling the siloxane to epoxy resin ratio. By increasingthe proportion of siloxane, an adhesive layer 406A-B with a reducedelastic modulus can be produced.

The adhesive layer 406A-B can include a blend of co-polymer, epoxy, orsilicone. A co-polymer of siloxane and epoxy can be produced and mixedwith an epoxy resin. Polysiloxane can have an epoxide group on a sidechain thereof and can be synthesized from methylhydrosiloxane, epoxyresin.

The outer conductive foil 408A-B can be coupled to the inner foil 404A-Busing the adhesive layer 406A-B. A periphery of the outer conductivefoil 408A-B can be substantially flush with a periphery of the base 402or a periphery of the inner foil 404A-B, such as shown in FIG. 4. Theouter conductive foil 408A-B can include a conductive material such ascopper, gold, silver, aluminum, a combination thereof, or otherconductive material. The outer conductive foil 408A-B can include athickness 418A-B that is smaller than a thickness 416A-B of the innerfoil 404A-B.

A yield loss realized in manufacturing a substrate onto the outerconductive foil 408A-B can be reduced by including an outer conductivefoil 408A-B with a thickness 418A-B that is smaller than the thickness416A-B of the inner foil 404A-B. In one or more embodiments, thethickness 418A-B of the outer conductive foil 408A-B can be betweenabout one and thirty micrometers. In one or more embodiments, thethickness 418A-B of the outer conductive foil 408A-B can be betweenabout two and fifteen micrometers. In one or more embodiments, thethickness 418A-B of the outer conductive foil 408A-B can be betweenabout two and six micrometers. In one more embodiments, the thickness418A-B of the outer conductive foil 408A-B can be between about threeand five micrometers. In one or more embodiments, the thickness 418A-Bof the outer conductive foil 408A-B can be about three, five, oreighteen micrometers.

As the thickness 418A-B of the outer conductive foil increases, theyield loss realized in manufacturing a substrate on the outer conductivefoil 408A-B can be decreased. However, if the thickness 418A-B of theouter conductive foil is too large, delamination of the outer conductivefoil 408A-B can increase yield loss. In an embodiment that includes anouter conductive foil 408A-B with a thickness 418A-B that is less thanfive micrometers, the outer conductive foil 408A-B may not be reliablyreleasable from the inner foil 404A-B. The outer conductive foil 408A-Bcan break in the separation process, or some residue from the outerconductive foil 408A-B or the adhesive layer 406A-B can be left on theinner foil 404A-B in the process of separating the outer conductive foil408A-B from the inner foil 404A-B.

A periphery of the inner foil 404A-B can be substantially flush with aperiphery of the base 402, such as shown in FIG. 4. A periphery of theouter conductive foil 408A-B can be substantially flush with a peripheryof the base 402 or a periphery of the inner foil 404A-B, such as shownin FIG. 4.

The protective material 412A-B can be situated on the outer conductivefoil 408A-B or on the side of the panel 400, such as to protect aninterface between the adhesive layer 406A-B and the outer conductivefoil 408A-B or the inner foil 404A-B. The protective material 412A-B canhelp protect the interface from chemicals, heat, bumping, or otherexternal forces that can delaminate or damage the material behind theprotective material 412A-B. The protective material 412A-D can include ametal, polymer, or other material that can adhere to the panel 400, suchas at the inner foil 404A-B, the outer conductive foil 408A-B, theadhesive layer 406A-B, or the base 402.

The protective material 412A-B can include a metal, such as copper,gold, silver, or other metal, or a polymer or plastic. The protectivematerial 412A-B can be electrolytically plated, applied in the form of asheet, or otherwise flowed or dispensed on or mechanically coupled tothe panel 400.

Adding the protective material 412A-B can reduce the yield loss or otherconcerns realized in using an outer conductive foil 408A-B with athickness 418A-B that is less than five micrometers.

FIG. 5 shows a block diagram of an example of a panel 500 according toone or more embodiments. The panel 500 can include the base 402, theinner foil 404A-B, the outer conductive foil 408A-B, the die 410A-B, ora connective material 518A, 518B, 518C, or 518D situated between theouter conductive foil 408A-B and the inner foil 404A-B. The panel 500can include an adhesive layer 406A-B situated between the inner foil404A-B and the outer conductive foil 408A-B (not shown in FIG. 5).

The connective material 518A-D can include solder paste, such as caninclude tin, silver, copper, lead, indium, a combination thereof, orother solder paste, or a solder thermal interface material, such as caninclude indium. The connective material 518A-D can be placed on theinner foil 404A-B, the outer conductive foil 408A-B can be placed on theinner foil 404A-B and the connective material 518A-B, and thecombination can be heat pressed to melt the connective material 518A-Dand form a mechanical connection between the inner foil 404A-B and theouter conductive foil 408A-B, such as to affix the inner foil 404A-B tothe outer conductive foil 408A-B, such as at or near edges of the innerfoil 404A-B or the outer conductive foil 408A-B.

In an embodiment that includes the adhesive layer 406A-B, the connectivematerial 518A-D can be situated along an edge of the panel 500, such asto protect the interface between the adhesive layer 406A-B and the innerfoil 404A-B or the outer conductive foil 408A-B.

The die 410A-B can be removed from the panel 500, such as by removingportions of the panel 500 that include the connective material 518A-D,such as by cutting the panel at the dotted lines 520A-B, and releasingthe outer conductive foil 408A-B from the panel 500. The outerconductive foil 408A-B can be removed from the die 410A-B or a substratewhich the die 410A-B is a part of, such as by etching away the outerconductive foil 408A-B.

FIG. 6 shows a block diagram of an example of a panel 600 according toone or more embodiments. The panel 600 can include the base 402, theinner foil 404A-B, an optional adhesive layer 406A-B, or the outerconductive foil 408A-B. The panel 600 can include one or more welds 616affixing the inner foil 404A-B to the outer conductive foil 408A-B.

The outer conductive foil 408A-B, the inner foil 404A-B or the base 402can include a width 614A-B, such as to make the outer conductive foil408A-B, inner foil 404A-B, or the base 402 have substantially the samewidth 614A-B. A width 618 of the welds 616 can be about one millimeteror less.

FIG. 7 shows a block diagram of a panel 700 that includes the panel 600with the die 410A-B situated on the outer conductive foil 408A-B and adielectric material 712A or 712B over or around (e.g., encasing) the die410A-B. Such embodiments can be considered “fully embedded” substratearchitectures, because the die 410A-B can be fully embedded in thedielectric (e.g., buildup) layer(s).

FIG. 8 shows a block diagram of a panel 800 that includes the panel 700after the welds 616 have been removed from the panel 700, such as bycutting the panel 700 at the dotted lines 714A-B. The die 410A-B and thedielectric material 712A-B can be removed from the panel 800, such as byreleasing the outer conductive foil 408A-B from the inner foil 404A-B.The outer conductive foil 408A-B can be removed from the dielectricmaterial 712A-B (e.g., an etch stop or build up material such asAjinomoto Buildup Film (ABF)) or the die 410A-B, such as by copperetching the outer conductive foil 408A-B.

FIG. 9 shows a block diagram of an example of a panel 900 that includesa partially embedded substrate (e.g., a conductive foil 914A or 914B,the die 410A-B and the dielectric material 916A-B). The panel 900 caninclude the base 402, the inner foil 404A-B, the adhesive layer 406A-B,the outer conductive foil 408A-B, a dielectric material 912A or 912B,the conductive foil 914A-B, the die 410A-B, or the dielectric material916A-B. The dielectric material 912A-B and the conductive foil 914A-Bcan be jointly considered a resin coated conductive foil. The conductivefoil 914A-B can be similar to the inner foil 404A-B or the outerconductive foil 408A-B.

A recess can be formed in the conductive foil 914A-B. The die 410A-B canbe situated in the recess. The dielectric material 916A-B can be flowed,dispensed, or applied over the conductive foil 914A-B and the die410A-B, such as to at least partially encase the die 410A-B in thedielectric material 916A-B.

The dielectric material 916A-B can be similar to the dielectric material712A-B. The substrate can be considered a partially embedded substratebecause the dielectric film only covers a portion of the die, theconductive foil that the die is inserted into can help cover theremainder of the die.

The substrate can be removed from the panel 900 by removing the edges ofthe panel 900, such as to remove the weld 616, such as by cutting thepanel at the dotted lines 918A-B. The outer conductive foil 408A-B canthen be released from the panel 900, such as at an interface between theouter conductive foil 408A-B and the adhesive layer 406A-B or the innerfoil 404A-B. The outer conductive foil 408A-B can then be removed fromthe partially embedded substrate, such as by etching the outerconductive foil 408A-B from the substrate. The dielectric material912A-B can then be removed from the partially embedded substrate, suchas by sand blasting, wet blasting, or cutting the dielectric material912A-B from the substrate.

Note that a fully embedded substrate or a partially embedded substratecan be built on any of the panels 400, 500, or 600. A fully embeddedsubstrate can include a die situated directly on the outer conductivefoil and embedded in dielectric material, such as shown in FIG. 7. Thepartially embedded substrate can include a die situated in a recess of aconductive foil that is situated on a dielectric material that issituated on the outer conductive foil. Dielectric material can be flowedover the die and the conductive foil of the partially embeddedsubstrate. The partially embedded substrate or the fully embeddedsubstrate can be BBUL substrates or cored substrates.

A substrate may be manufactured on the panel without a die situatedtherein. Such substrates can be a cored die substrate. A coreless diesubstrate can include a substrate that is built up and a die is attachedto the die substrate after the die substrate is built. A cored diesubstrate can include a substrate that includes a die arranged in thesubstrate and at least a portion of the substrate is built around thedie. A BBUL die substrate can include a substrate that includes a diewith one or more buildup layers built above the die to form the diesubstrate.

While one die is shown in the FIGS., multiple dies can be situated onthe panel. The substrate can include a Bumpless Buildup Layer (BBUL)substrate, a Flip Chip substrate, a Surface Mount (SMT) substrate, orother type of substrate.

Note that while embodiments of panels discussed herein are double-sided(i.e. the panels include an inner foil, adhesive layer, and outerconductive foil all situated on opposite sides of the base), the panelcan be one-sided. One sided panels are less efficient in terms ofthroughput, but can include simpler processing at a manufacturingfacility.

Processing to make the panel 400, 500, 600, 700, 800, or 900 can besimpler or cheaper than the processing to make the panel 300 or thepanel 100. The processing can be simpler in that the inner foil and theouter conductive foil need not be processed to fit in a recess of thebase. Also, the base 402 does not need to be processed to include arecess in which the inner foil or the outer conductive foil can besituated in. By removing a processing step, the cost of manufacturingthe panel 400, 500, 600, 700, 800, or 900 can be reduced as compared tothe cost of manufacturing the panel 100 or 300. Manufacturing the panel400, 500, 600, 700, 800, or 900 can be simpler than processing to makethe panel 300 because the panel 400, 500, 600, 700, 800, or 900 does notrequire the precise alignment considerations as in the manufacturing ofthe panel 100 or 300. The active area the area on which a substrate canbe built) of the panel 400, 500, 600, 700, 800, or 900 can be largerthan the active area of the panel 100.

FIG. 10 shows a flow diagram of an example of a technique 1000 formaking a panel according to one or more embodiments. At 1002, a panelcan be pressed. Pressing the panel can include arranging a panel ofinner foil on a base, optionally arranging an adhesive layer on theinner foil, optionally arranging connective material on the inner foil,arranging an outer conductive foil on the inner foil, and mechanicallypressing the arranges materials, such as under heat, pressure, or in avacuum.

At 1004, the inner and outer conductive foils can be mechanicallycoupled to each other. Mechanically coupling the inner and outerconductive foils can include melting a connective material situatedbetween the inner and outer conductive foils, welding (e.g., laserwelding) the outer conductive foil to the inner foil, or situatingprotective material on the edge of the inner and outer conductive foil(e.g., to protect an adhesive layer coupling the inner and outerconductive foils).

At 1006, edges of the panel can be trimmed (e.g., cut or otherwiseremoved), such as to remove the mechanical coupling between the innerand outer conductive foils (e.g., to remove the weld, at least a portionof the protective material, or the connective material). At 1008, theouter conductive foil can be released from the panel.

Building a panel using the technique 1000 can be more cost effectivethan building a panel using the technique 200. This can be due toreduced number of steps in the technique 1000 as compared to thetechnique 200. In the technique 1000 there is no masking filmlamination, panel expose or etch, or masking film removal process.Removing a process of the technique can reduce the cost of making apanel using the technique and increase through put by decreasing theamount of time it takes to make a panel using the technique.

FIG. 11 shows a flow diagram of an example of a technique 1100 accordingto one or more embodiments. At 1102, an inner foil can be coupled (e.g.,mechanically coupled or affixed) to a substantially rectangular base. At1104, an outer conductive foil can be situated on or over the innerfoil. At 1106, the inner foil and the outer conductive foil can becoupled together (affixed to each other) near edges of the outerconductive foil and the inner foil, such as by using a connectivematerial. Coupling the inner foil and the outer conductive foil caninclude welding the inner foil to the outer conductive foil. Theconnective material can include a solder paste and coupling the innerfoil and the outer conductive foil can include reflowing the solderpaste between the inner foil and the outer conductive foil.

The technique 1100 can include situating a fully embedded substrate onthe outer conductive foil. Situating the fully embedded substrate on theouter conductive foil can include situating a die on the outerconductive foil and situating a dielectric material over and around thedie. Situating the fully embedded substrate on the outer conductive foilcan include forming a coreless substrate, cored substrate, or a BBULsubstrate on the outer conductive foil.

The technique 1100 can include situating a partially embedded substrateon the outer conductive foil. Situating the partially embedded substrateon the outer conductive foil can include: (1) situating a resin coatedcopper on the outer conductive foil, (2) forming a recess in the resincoated copper, (3) situating a die situated in the recess, or (4)situating a dielectric material over the die and the resin coatedcopper. Situating the partially embedded substrate on the outerconductive foil can include forming a coreless substrate, coredsubstrate, or a BBUL substrate on the outer conductive foil.

FIG. 12 is a block diagram illustrating an example computer system 1200machine which can include a substrate that was built on a panel asdiscussed herein. Computer system 1200 can be a computing device. In anexample, the machine can operate as a standalone device or can beconnected (e.g., via a cellular network) to other machines. In anetworked deployment, the machine can operate in the capacity of eithera server or a client machine in server-client network environments, orit can act as a peer machine in peer-to-peer (or distributed) networkenvironments. Further, while only a single machine is illustrated, theterm “machine” shall also be taken to include any collection of machinesthat individually or jointly execute a set (or multiple sets) ofinstructions to perform any one or more of the methodologies discussedherein.

Example computer system 1200 can include a processor 1202 (e.g., aCentral Processing Unit (CPU), a Graphics Processing Unit (GPU) orboth), a main memory 1204 and a static memory 1206, which communicatewith each other via an interconnect 1208 (e.g., a link, a bus, etc.).The computer system 1200 can further include a video display unit 1210,an alphanumeric input device 1212 (e.g., a keyboard), and a UserInterface (UI) navigation device 1214 (e.g., a mouse). In an example,the video display unit 1210, input device 1212 and UI navigation device1214 are a touch screen display. The computer system 1200 canadditionally include a storage device 1216 (e.g., a drive unit), asignal generation device 1218 (e.g., a speaker), an output controller1232, a power management controller 1234, and a network interface device1220 (which can include or operably communicate with one or moreantennas 1230, transceivers, or other wireless communications hardware),and one or more sensors 1228, such as a GPS sensor, compass, locationsensor, accelerometer, or other sensor. The antennas 1230 can be coupledto a network 1226. Any of the items of the system 1200 can include asubstrate built on a panel discussed herein.

Examples and Notes

The present subject matter may be described by way of several examples.

Example 1 can include or use subject matter (such as an apparatus, amethod, a means for performing acts, or a device readable memoryincluding instructions that, when performed by the device, can cause thedevice to perform acts), such as can include or use a substantiallyrectangular base, an inner foil mechanically coupled to the base, anouter conductive foil situated over the inner foil, and connectivematerial coupling the inner foil and the outer conductive foil nearedges of the outer conductive foil and the inner foil.

Example 2 can include or use, or can optionally be combined with thesubject matter of Example 1, to include or use, wherein the connectivematerial includes a weld.

Example 3 can include or use, or can optionally be combined with thesubject matter of Example 1, to include or use, wherein the connectivematerial includes a solder paste.

Example 4 can include or use, or can optionally be combined with thesubject matter of at least one of Examples 1-3, to include or use afully embedded substrate situated on the outer conductive foil.

Example 5 can include or use, or can optionally be combined with thesubject matter of Example 4, to include or use, wherein the fullyembedded substrate includes a die situated on the outer conductive foiland a dielectric material situated over and around the die.

Example 6 can include or use, or can optionally be combined with thesubject matter of at least one of Examples 4-5, to include or use,wherein the fully embedded substrate is a cored substrate or a BumplessBuildup Layer (BBUL) substrate.

Example 7 can include or use, or can optionally be combined with thesubject matter of at least one of Examples 1-3, to include or use apartially embedded substrate situated on the outer conductive foil.

Example 8 can include or use, or can optionally be combined with thesubject matter of Example 7 to include or use, wherein the partiallyembedded substrate includes (1) a resin coated copper situated on theouter conductive foil, (2) a recess formed in the resin coated copper,(3) a die situated in the recess, or (4) a dielectric material situatedover the die and the resin coated copper.

Example 9 can include or use, or can optionally be combined with thesubject matter of at least one of Examples 7-8 to include or use,wherein the partially embedded substrate is a cored substrate or aBumpless Buildup Layer (BBUL) substrate.

Example 10 can include or use subject matter (such as an apparatus, amethod, a means for performing acts, or a device readable memoryincluding instructions that, when performed by the device, can cause thedevice to perform acts), such as can include or use coupling an innerfoil to a substantially rectangular base, situating an outer conductivefoil situated on the inner foil, or coupling, using a connectivematerial, the inner foil and the outer conductive foil near edges of theouter conductive foil and the inner foil.

Example 11 can include or use, or can optionally be combined with thesubject matter of Example 10 to include or use, wherein coupling theinner foil and the outer conductive foil includes welding the inner foilto the outer conductive foil.

Example 12 can include or use, or can optionally be combined with thesubject matter of Example 10 to include or use, wherein the connectivematerial includes a solder paste and coupling the inner foil and theouter conductive foil includes reflowing the solder paste between theinner foil and the outer conductive foil.

Example 13 can include or use, or can optionally be combined with thesubject matter of at least one of Examples 10-12 to include or use,situating a fully embedded substrate on the outer conductive foil.

Example 14 can include or use, or can optionally be combined with thesubject matter of Example 13 to include or use, wherein situating thefully embedded substrate on the outer conductive foil includes situatinga die on the outer conductive foil and situating a dielectric materialover and around the die.

Example 15 can include or use, or can optionally be combined with thesubject matter of at least one of Examples 13-14 to include or use,wherein situating the fully embedded substrate on the outer conductivefoil includes forming a cored substrate, or a Bumpless Buildup Layer(BBUL) substrate on the outer conductive foil.

Example 16 can include or use, or can optionally be combined with thesubject matter of at least one of Examples 10-12 to include or use,situating a partially embedded substrate on the outer conductive foil.

Example 17 can include or use, or can optionally be combined with thesubject matter of Example 16 to include or use, wherein situating thepartially embedded substrate on the outer conductive foil includes (1)situating a resin coated copper on the outer conductive foil, (2)forming a recess in the resin coated copper, (3) situating a diesituated in the recess, or (4) situating a dielectric material over thedie and the resin coated copper.

Example 18 can include or use, or can optionally be combined with thesubject matter of at least one of Examples 16-17 to include or use,wherein situating the partially embedded substrate on the outerconductive foil includes forming a cored substrate or a Bumpless BuildupLayer (BBUL) substrate on the outer conductive foil.

Example 19 can include or use subject matter (such as an apparatus, amethod, a means for performing acts, or a device readable memoryincluding instructions that, when performed by the device, can cause thedevice to perform acts), such as can include or use (1) a substantiallyrectangular base, (2) a first inner foil mechanically coupled to a firstside of the base, (3) a second inner foil mechanically coupled to asecond side of the base, the second side of the base opposite the firstside of the base, (4) a first outer conductive foil situated on thefirst inner foil, (5) a second outer conductive foil situated on thesecond inner foil, or (6) connective material coupling the first innerfoil and the first outer conductive foil near edges of the first outerconductive foil and the first inner foil and coupling the second innerfoil and the second outer conductive foil near edges of the second outerconductive foil and the second inner foil.

Example 20 can include or use, or can optionally be combined with thesubject matter of Example 19 to include or use, wherein the connectivematerial includes a weld.

Example 21 can include or use, or can optionally be combined with thesubject matter of Example 19 to include or use, wherein the connectivematerial includes a solder paste.

Example 22 can include or use, or can optionally be combined with thesubject matter of at least one of Examples 19-21 to include or use afirst fully embedded substrate situated on the first outer conductivefoil and a second fully embedded substrate situated on the second outerconductive foil.

Example 23 can include or use, or can optionally be combined with thesubject matter of Example 22 to include or use, wherein the first fullyembedded substrate includes a first die situated on the first outerconductive foil and a first dielectric material situated over and aroundthe first die.

Example 24 can include or use, or can optionally be combined with thesubject matter of at least one of Examples 22-23 to include or use,wherein the first fully embedded substrate is a cored substrate or aBumpless Buildup Layer (BBUL) substrate.

Example 25 can include or use, or can optionally be combined with thesubject matter of at least one of Examples 19-21 to include or use afirst partially embedded substrate situated on the first outerconductive foil and a second partially embedded substrate situated onthe second outer conductive foil.

Example 26 can include or use, or can optionally be combined with thesubject matter of Example 25 to include or use, wherein the firstpartially embedded substrate includes (1) a resin coated copper situatedon the first outer conductive foil, (2) a recess formed in the resincoated copper, (3) a die situated in the recess, or (4) a dielectricmaterial situated over the die and the resin coated copper.

Example 27 can include or use, or can optionally be combined with thesubject matter of at least one of Examples 25-26 to include or use,wherein the first partially embedded substrate is a cored substrate or aBumpless Buildup Layer (BBUL) substrate.

The above detailed description includes references to the accompanyingdrawings, which form a part of the detailed description. The drawingsshow, by way of illustration, specific embodiments in which methods,apparatuses, and systems discussed herein can be practiced. Theseembodiments are also referred to herein as “examples.” Such examples caninclude elements in addition to those shown or described. However, thepresent inventors also contemplate examples in which only those elementsshown or described are provided, Moreover, the present inventors alsocontemplate examples using any combination or permutation of thoseelements shown or described (or one or more aspects thereof), eitherwith respect to a particular example (or one or more aspects thereof),or with respect to other examples (or one or more aspects thereof) shownor described herein.

In this document, the terms “a” or “an” are used, as is common in patentdocuments, to include one or more than one, independent of any otherinstances or usages of “at least one” or “one or more.” In thisdocument, the term “or” is used to refer to a nonexclusive or, such that“A or B” includes “A but not B,” “B but not A,” and “A and B,” unlessotherwise indicated. In this document, the terms “including” and “inwhich” are used as the plain-English equivalents of the respective terms“comprising” and “wherein.” Also, in the following claims, the terms“including” and “comprising” are open-ended, that is, a system, device,article, composition, formulation, or process that includes elements inaddition to those listed after such a term in a claim are still deemedto fall within the scope of that claim. Moreover, in the followingclaims, the terms “first,” “second,” and “third,” etc. are used merelyas labels, and are not intended to impose numerical requirements ontheir objects.

As used herein, a “-” (dash) used when referring to a reference numbermeans “or”, in the non-exclusive sense discussed in the previousparagraph, of all elements within the range indicated by the dash. Forexample, 103A-B means a nonexclusive “or” of the elements in the range{103A, 103B}, such that 103A-103B includes “103A but not 103B”, “103Bbut not 103A”, and “103A and 103B”.

The above description is intended to be illustrative, and notrestrictive. For example, the above-described examples (or one or moreaspects thereof) may be used in combination with each other. Otherembodiments can be used, such as by one of ordinary skill in the artupon reviewing the above description. The Abstract is provided to complywith 37 C.F.R. §1.72(b), to allow the reader to quickly ascertain thenature of the technical disclosure. It is submitted with theunderstanding that it will not be used to interpret or limit the scopeor meaning of the claims. Also, in the above Detailed Description,various features may be grouped together to streamline the disclosure,This should not be interpreted as intending that an unclaimed disclosedfeature is essential to any claim. Rather, inventive subject matter maylie in less than all features of a particular disclosed embodiment.Thus, the following claims are hereby incorporated into the DetailedDescription as examples or embodiments, with each claim standing on itsown as a separate embodiment, and it is contemplated that suchembodiments can be combined with each other in various combinations orpermutations. The scope of the invention should be determined withreference to the appended claims, along with the full scope ofequivalents to which such claims are entitled.

1. (canceled)
 2. A device comprising: a base including a cloth material;a copper inner foil coupled to the base; an outer foil situated over andreleasably coupled to the inner foil; and connective material couplingthe inner foil and the outer foil, the connective material including atleast one of an epoxy and a resin.
 3. The device of claim 2, wherein theconnective material includes a resin.
 4. The device of claim 2, whereinthe base further includes a resin.
 5. The device of claim 2, wherein thebase includes a recess and the inner foil is situated, at leastpartially in the recess.
 6. The device of claim 2, wherein a thicknessof the inner foil is between about twenty-five micrometers and about onehundred micrometers.
 7. The device of claim 2, wherein the outer foil isconductive.
 8. The device of claim 7, wherein the outer foil includescopper.
 9. A device comprising: a base including a recess; a copperinner foil coupled to the base and situated, at least partially, in therecess; an outer foil situated over and releasably coupled to the innerfoil; and connective material coupling the inner foil and the outerfoil, the connective material including at least one of an epoxy and aresin.
 10. The device of claim 9, wherein the connective materialincludes a resin.
 11. The device of claim 9, wherein the base includes acloth.
 12. The device of claim 11, wherein the base further includes aresin.
 13. The device of claim 9, wherein a thickness of the inner foilis between about twenty-five micrometers and about one hundredmicrometers.
 14. The device of claim 9, wherein the outer foil isconductive.
 15. The device of claim 14, wherein the outer foil includescopper.
 16. A method comprising: situating a copper inner foil on abase, the base including at least one of a cloth and a resin: situatinga connective material over the inner foil; situating an outer foil onthe connective material; and removing the outer foil from the base. 17.The method of claim 16, wherein situating the inner foil on the baseincludes exposing the inner foil in a recess in the base.
 18. The methodof claim 16, further comprising forming circuitry on the outer foil. 19.The method of claim 16, wherein the outer foil is conductive,
 20. Themethod of claim 19, wherein the outer foil include copper.
 21. Themethod of claim 16, further comprising pressing the inner foil into thebase by applying a mechanical force to the inner foil.